Engineering

Input: un-inspected wafer in cassette form
Output: inspected wafer in cassette form

- Auto loader/unloader for wafer frame
- Capable of handling up to 12” wafer
- Window platform with user-defined specifications
- Built-in calibration feature
- Library based uploading for different types of die
- Automated defect classification
- Wafer map creation/updates of loaded wafer map
- Optional inking capability for defect dies
- Statistical descriptive analysis of defects

Input: leadframe/board form
Output: leadframe/board form

- High-resolution and high-precision X-Y table
- Multiple inspection stations
- Auto marking for rejects
- Micro defect inspection of up to 5 micron
- Window platform with user-defined specifications
- Built-in calibration feature
- Auto-generation of GR&R report
- Library based uploading for different types of die

- Orientation check
- Device check
- Centering position/offset inspection
- Silver epoxy coverage inspection
- Wire loop height measurement
- Wire bond inspection e.g. sagging wire, missing bond, off pad etc

Input: tray form / leadframe form
Output: tray form / leadframe form

- Auto loader/unloader for input/output
- Servo-driven linear X table
- Multi-tasking PC-based controller
- Antistatic brush (optional)

- QFN, DFN, MLP, QFP, CSP, BGA, VSOJ, etc

- Position feedback
- Orientation check
- Double Mark inspection
- Package type confirmation
- Marking Quality Inspection

Input: tube form
Output: tube form

- Auto loader/unloader for input/output
- Servo-driven linear X table
- Multi-tasking PLC-based controller
- Orientation inspection (optional)

- Seven Segment Display, QFN, DFN, MLP, QFP, CSP, BGA, VSOJ, etc.

- Position feedback
- Orientation check
- Double Mark inspection
- Package type confirmation

Input: loosen form/tube
Output: tube form

- Multiple component handling
- Teflon claw to avoid cosmetic rejects
- Multi-tasking PC-based controller

- Mainly for component assembly

- Marking inspection

Input: reel form
Output: tray form

- Servo-driven de-tape module
- High speed flipper
- Rotary pick-&-place method
- Multi-tasking PC-based controller
- Close-loop place positioning feedback

- QFN, MLP, QFP, SSOP, MSOP, TSSOP, VSOJ, D2PAK, D-PAK, SO, SOL, SOJ, SOT, SC, SOIC, LED, etc.

- Position inspection
- Orientation check
- Glue inspection
- Package inspection

Input: tube
Output: tube/bin

- Multiple bin output
- Single/double-stack tube unloader
- Multi-tasking PC-based controller
- Poka yoke concept for sorting
- Dynamic binning option

- LED
- DIP, PDIP, TO
- SOIC, SSOP, MSOP, QSOP, TSSOP
- D2PAK, D-PAK, SO, SOL, SOJ, SOP
- QFN/MLP

- Mark inspection
- Package dimension check
- Package cosmetic inspection

Input: tray form
Output: tray form

- Auto loader/unloader for input/output trays
- Servo-driven linear XY pick and place system
- Multi-tasking PC-based controller
- Gang test (optional)
- Fine pitch probing

- QFN, DFN, MLP, QFP, CSP, BGA, VSOJ, etc

- Position inspection
- Orientation check
- Mark inspection
- 5-side inspection
- Pad inspection
- Package inspection
- In-pocket inspection

Input: tray form/loose form/tube form
Output: tape & reel

- Rotary pick and place system
- Auto loader/unloader for input trays
- Multiple test stations
- Multi-tasking PC-based controller
- Programmable leader & trailer

- QFN, MLP, QFP, SSOP, MSOP, TSSOP, VSOJ
- D2PAK, D-PAK, SO, SOL, SOJ, SOT, SC, SOIC
- LED

- Orientation check
- Mark inspection
- Lead co-planarity inspection
- In-pocket inspection

Input: tray form/loose form/tube form
Output: tape & reel

- Rotary pick and place system
- Auto loader/unloader for input trays
- Multi-tasking PC-based controller
- Programmable leader & trailer

- QFN, DFN, MLP, QFP, CSP, BGA, VSOJ, etc. - D2PAK, D-PAK, SO, SOL, SOJ, SOT, SC, SOIC - LED

- Orientation check
- Mark inspection
- Lead co-planarity inspection
- In-pocket inspection

Input: loose form
Output: loose form / tape & reel

- Rotary pick and place system
- Multiple test stations
- Multiple tape and reel modules (optional)
- Multi-tasking PC-based controller
- Programmable leader & trailer

- QFN, MLP, QFP, SSOP, MSOP, TSSOP, VSOJ
- D2PAK, D-PAK, SO, SOL, SOJ, SOT, SC, SOIC
- LED

- Orientation check
- Mark inspection
- Lead co-planarity inspection
- In-pocket inspection